Dividend history for Hua Hong Semiconductor Limited (1347.HK)

Hua Hong Semiconductor Limited (stock symbol: 1347.HK) made a total of 5 dividend payments.
The sum of all dividends (adjusted for stock splits) is : HK$1.36
Dividend yield (TTM) : 0.00% See Hua Hong Semiconductor Limited dividend yield history

Dividend payments for Hua Hong Semiconductor Limited (1347.HK) from 2016 to 2024

Annual dividend payments

Year	Dividend (stock split adjusted)	Change
2024	HK$0.16	-46.77%
2019	HK$0.31	N/A
2018	HK$0.31	3.33%
2017	HK$0.30	11.11%
2016	HK$0.27	N/A

List of all dividend payments

Date	Dividend (stock split adjusted)	Change
2024-06-03	HK$0.16	-46.77%
2019-05-14	HK$0.31	N/A
2018-05-14	HK$0.31	3.33%
2017-05-16	HK$0.30	11.11%
2016-05-13	HK$0.27	N/A

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