Dividend history for Hua Hong Semiconductor Limited (1347.HK)

Hua Hong Semiconductor Limited (stock symbol: 1347.HK) made a total of 5 dividend payments.
The sum of all dividends (adjusted for stock splits) is : S$0.22
Dividend yield (TTM) : 0.00% See Hua Hong Semiconductor Limited dividend yield history

Dividend payments for Hua Hong Semiconductor Limited (1347.HK) from 2016 to 2024

Annual dividend payments

Year	Dividend (stock split adjusted)	Change
2024	S$0.02728	-46.77%
2019	S$0.05125	N/A
2018	S$0.05125	3.33%
2017	S$0.04960	11.11%
2016	S$0.04464	N/A

List of all dividend payments

Date	Dividend (stock split adjusted)	Change
2024-06-03	S$0.02728	-46.77%
2019-05-14	S$0.05125	N/A
2018-05-14	S$0.05125	3.33%
2017-05-16	S$0.04960	11.11%
2016-05-13	S$0.04464	N/A

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