SAMSUNG S&P High Dividend APAC ex NZ REITs ETF
3187.HK
#3356
ETF rang
€13.77 M
Capitalisation boursière
🇭🇰 HK
Marché
1,81 €
Prix de l'action
0.73%
Changement (1 jour)
-3.47%
Changement (1 an)

SAMSUNG S&P High Dividend APAC ex NZ REITs ETF - Composition

Composition de l'ETF au 3 Septembre, 2026Nombre de participations : 30

Liste complète de la composition

Poids %NomSymbole
11.07%
STOCKLANDSGP
9.55%
LINK REIT823
9.51%
CAPITALAND INTERGRATED COMMERCICT
7.47%
MIRVAC GROUPMGR
6.31%
DEXUS/AUDXS
4.16%
JAPAN METROPOLITAN FUND INVE8953
3.48%
MAPLETREE INDUSTRIAL TRUSTMINT
3.31%
GLP J-REIT3281
3.28%
MAPLETREE LOGISTICS TRUSTMLT
3.19%
KDX REALTY INVESTMENT CORP8972
2.70%
UNITED URBAN INVESTMENT CORP8960
2.70%
DAIWA HOUSE REIT INVESTMENT8984
2.67%
REGION GROUPRGN
2.57%
JAPAN HOTEL REIT INVESTMENT8985
2.52%
FRASERS CENTREPOINT TRUSTFCT
2.47%
INVINCIBLE INVESTMENT CORP8963
2.35%
CHARTER HALL LONG WALE REITCLW
2.34%
KEPPEL REITKREIT
2.33%
MAPLETREE PAN ASIA COM TRUSTMPACT
2.30%
FRASERS LOGISTICS & COMMERCIFLT
2.03%
CHARTER HALL RETAIL REITCQR
1.96%
CAPITALAND ASCOTT TRUSTCLAS
1.90%
INDUSTRIAL & INFRASTRUCTURE3249
1.68%
SEKISUI HOUSE REIT INC3309
1.34%
LASALLE LOGIPORT REIT3466
1.16%
LENDLEASE GLOBAL COMMERCIALLREIT
1.08%
AEON REIT INVESTMENT CORP3292
1.07%
MITSUI FUDOSAN RETAIL FUND I8964
0.81%
HEIWA REAL ESTATE REIT INC8966
0.69%
GLOBAL ONE REIT8958